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NCP186AMN080TBG - onsemi

Description: LDO Voltage Regulators FAST TRANSIENT RESPONSE LOW VOLTAGE 1A LDO ACT DISCHARGE VOUT= 0.8V

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PCB Footprints
NCP186AMN080TBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN12, 4x4, 0.65P CASE 506CE ISSUE O_2022
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3D Models
NCP186AMN080TBG - onsemi  - 3D model - Small Outline No-lead - DFN12, 4x4, 0.65P CASE 506CE ISSUE O_2022
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NCP186AMN080TBG Details

  • Manufacturer Part Number:

    NCP186AMN080TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-12

  • Manufacturer Package Code:

    506CE

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2018-10-01

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustability:

    ADJUSTABLE

  • Input-Output Voltage Differential-Max:

    1.6 V

  • Input-Output Voltage Differential-Min:

    0.5 V

  • JESD-30 Code:

    S-PDSO-N12

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Line Regulation-Max (%/V):

    0.1

  • Load Regulation-Max(%):

    0.625%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    12

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1 A

  • Output Voltage1-Max:

    3.9 V

  • Output Voltage1-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC12,.16,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

NCP186AMN080TBG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities at higher temperatures.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially even device failure. It's crucial to ensure the device operates within the recommended temperature range.
  • The NCP186AMN080TBG is an automotive-grade device, making it suitable for high-reliability and automotive applications. However, it's essential to review the device's specifications and ensure it meets the specific requirements of your application.
  • To troubleshoot issues, start by reviewing the device's operating conditions, ensuring proper thermal design, and checking for any electrical overstress. Consult the datasheet and application notes for guidance, and consider seeking support from onsemi's technical support team if needed.

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