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NCP3064DR2G - onsemi

Description: Operation up to 40 V Input; Frequency operation up to 150 kHz (250 kHz if used as a controller); Internal thermal Shutdown with hysteresis; Cycle-by-Cycle Current Limiting; Low power standby mode (<100µA)

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NCP3064DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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NCP3064DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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NCP3064DR2G Details

  • Manufacturer Part Number:

    NCP3064DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8 Narrow Body-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.6

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    HYSTERETIC CURRENT MODE

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    7 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    190 kHz

  • Technology:

    PMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP3064DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP3064DR2G should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces under the device, and use thermal vias to connect the thermal pad to a heat sink or a copper plane.
  • To ensure reliable start-up and shutdown, ensure that the input voltage (VIN) rises and falls monotonically, and that the enable pin (EN) is properly driven. Avoid sudden changes in VIN or EN, and ensure that the device is fully enabled before applying a load.
  • Operating the NCP3064DR2G at high ambient temperatures can reduce its reliability and lifespan. Ensure good airflow, use a heat sink if necessary, and derate the device's output current according to the datasheet's thermal derating curves.
  • To minimize EMI, use a good PCB layout, keep the device and its associated components close together, and use a common-mode choke or ferrite bead on the output. Ensure that the device's switching frequency is not harmonically related to other system frequencies.
  • When selecting the output capacitor, consider the capacitor's equivalent series resistance (ESR), capacitance value, and voltage rating. A low-ESR capacitor with a suitable capacitance value (e.g., 10-22 μF) and voltage rating (e.g., 6.3 V or higher) is recommended.

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NCP3064DR2G Overview

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