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NCP3231AMNTXG - onsemi

Description: Buck Converter - High Current, Synchronous, QFN40

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NCP3231AMNTXG - onsemi PCB footprint - Other - Other - QFN40 6x6, 0.5P CASE 485CM ISSUE O_ffw
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NCP3231AMNTXG - onsemi  - 3D model - Other - QFN40 6x6, 0.5P CASE 485CM ISSUE O_ffw
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NCP3231AMNTXG Details

  • Manufacturer Part Number:

    NCP3231AMNTXG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-40

  • Manufacturer Package Code:

    485CM

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    90 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    500 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

NCP3231AMNTXG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (–40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling capability at high temperatures.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10-22 μF is recommended. This helps to filter out high-frequency noise and ensure stable operation.
  • Use a shielded inductor, keep the layout compact, and minimize loop areas. Also, consider adding EMI filters or shielding to the PCB to reduce radiated emissions.
  • The maximum allowed voltage on the VIN pin is 28 V. Exceeding this voltage may damage the device.

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