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NCP360SNAET1G - onsemi

Description: These are Pb-Free Devices; Very Fast Protection, Up to 20 V, with 25 µA Current Consumption; On-chip PMOS Transistor; Overvoltage Lockout (OVLO); Undervoltage Lockout (UVLO); Alert FLAG Output; EN Enable Pin; Thermal Shutdown; 6-Lead UDFN 2 x 2 mm Package; TSOP-5 3 x 3 mm Package; Personal Digital Applications; MP3 Players; Computing

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PCB Footprints
NCP360SNAET1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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3D Models
NCP360SNAET1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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NCP360SNAET1G Details

  • Manufacturer Part Number:

    NCP360SNAET1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6.98

  • Built-in Protections:

    TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    1.2 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    1.5 µs

  • Width:

    1.5 mm

NCP360SNAET1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Use a pi-filter or LC filter configuration to reduce EMI emissions. Place the filter components close to the device to minimize noise coupling. Also, use a shielded cable or twisted pair wiring to reduce radiated emissions.
  • Use the device's low-power mode (if available) and optimize the system's power management scheme to minimize power consumption. Also, consider using a low-dropout regulator (LDO) to reduce power losses.
  • Onsemi performs various reliability tests, including high-temperature operating life (HTOL), temperature humidity bias (THB), and electrostatic discharge (ESD) testing. The device is also qualified according to AEC-Q100 and other industry standards.

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NCP360SNAET1G Overview

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