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NCP45520IMNTWG-H - onsemi

Description: Advanced Controller with Charge Pump; Integrated N-Channel MOSFET; Soft-Start via Slew Rate Control (NCP45521-Adjustable, NCP45520-Fixed); Ultra-Low On-Resistance; Input Voltage Range 0.5 V to 13.5 V (18V Tolerant); Low Standby Current; Quick Output Discharge Function (Adjustable); No External Components Required; Enable Pins with CMOS Input Levels; Power Good Signaling (NCP45520); Fault Protection: Over Temperature; Fault Protection: Under Voltage Lockout; Fault Protection: Short-Circuit Protection; Pb-Fre

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PCB Footprints
NCP45520IMNTWG-H - onsemi PCB footprint - Other - Other - DFN8 2x2, 0.5P CASE 506CC ISSUE A
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NCP45520IMNTWG-H - onsemi  - 3D model - Other - DFN8 2x2, 0.5P CASE 506CC ISSUE A
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NCP45520IMNTWG-H Details

  • Manufacturer Part Number:

    NCP45520IMNTWG-H

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN8 2x2, 0.5P

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    506CC

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    13.5 V

  • Supply Voltage1-Min:

    0.5 V

  • Supply Voltage1-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NCP45520IMNTWG-H Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure the device is properly biased, make sure to follow the recommended voltage and current ratings specified in the datasheet. The input voltage should be within the recommended range, and the output voltage should be set using a suitable resistor divider network. Additionally, ensure that the device is operated within the recommended temperature range.
  • To ensure EMI and EMC compliance, follow proper PCB layout and design guidelines, such as keeping the device away from noise sources, using shielding, and minimizing loop areas. Additionally, use a common-mode choke or ferrite bead to filter out high-frequency noise, and ensure that the device is properly decoupled using capacitors.
  • To troubleshoot issues with the device, start by verifying the input voltage and current ratings, and ensuring that the device is properly biased. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to monitor the output voltage and current, and check for any signs of oscillation or instability. Consult the datasheet and application notes for troubleshooting guidelines.
  • To ensure the device is stored and handled properly, follow proper electrostatic discharge (ESD) precautions, such as using ESD-safe packaging and handling the device by the body or pins. Store the device in a cool, dry place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the device by the body or pins to prevent damage.

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