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NCP500SN33T1G - onsemi

Description: Ultra-Low Dropout Voltage of 170 mV at 150 mA; Fast Enable Turn-On Time of 20 µsec; Wide Operating Voltage Range of 1.8 V to 6.0 V; Excellent Line and Load Regulation; High Accuracy Output Voltage of 2.5%; Enable Can Be Driven Directly by 1.0 V Logic; Very Small QFN 2x2 Package; Pb-Free Package May be Available.* The G-Suffix Denotes a Pb-Free Lead Finish

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PCB Footprints
NCP500SN33T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 CASE 483-02 (issue K)
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NCP500SN33T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP-5 CASE 483-02 (issue K)
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NCP500SN33T1G Details

  • Manufacturer Part Number:

    NCP500SN33T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.23 V

  • Dropout Voltage1-Nom:

    0.15 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    6 V

  • Input Voltage-Min:

    3.8 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.01%

  • Load Regulation-Max:

    0.045%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    3.383 V

  • Output Voltage1-Min:

    3.218 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2.5%

  • Width:

    1.5 mm

NCP500SN33T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a heat sink.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to reduce the junction temperature. Also, consider derating the device's power handling capability at high temperatures.
  • The NCP500SN33T1G has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the NCP500SN33T1G is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards or customer requirements.
  • Use thermal imaging or an infrared thermometer to measure the device's temperature. Check for proper PCB layout, thermal pad connection, and heat sink attachment. Verify that the device is operated within the recommended power and temperature ranges.

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