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NCP5359DR2G - onsemi

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NCP5359DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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NCP5359DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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NCP5359DR2G Details

  • Manufacturer Part Number:

    NCP5359DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SO-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Output Characteristics:

    STANDARD

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    13.2 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    35 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.035 µs

  • Turn-on Time:

    0.035 µs

  • Width:

    3.9 mm

NCP5359DR2G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to have a solid copper plane under the device, and to use thermal vias to connect the plane to the thermal pad of the device. Additionally, keeping the PCB layer stack-up symmetrical and using a thermal interface material (TIM) between the device and the heat sink can also improve thermal performance.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) and the maximum ambient temperature (Ta). Additionally, using a heat sink with a suitable thermal resistance, and ensuring good airflow around the device can help to reduce the junction temperature and prevent thermal shutdown.
  • The recommended input capacitor type is a low-ESR ceramic capacitor, such as an X5R or X7R dielectric capacitor. The recommended value is typically in the range of 4.7uF to 10uF, depending on the specific application and input voltage ripple requirements.
  • To troubleshoot issues with the device not turning on or not regulating the output voltage, check the input voltage, enable pin, and output voltage feedback connections. Ensure that the input voltage is within the recommended range, the enable pin is properly biased, and the output voltage feedback network is correctly configured. Also, check for any signs of overheating, such as excessive current draw or high junction temperature.
  • The recommended output capacitor type is a low-ESR ceramic capacitor, such as an X5R or X7R dielectric capacitor. The recommended value depends on the specific application and output voltage ripple requirements, but a typical value is in the range of 10uF to 22uF.

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NCP5359DR2G Overview

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