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NCP565MN33T2G - onsemi

Description: Last Shipments - LDO Regulator, 1.5 A, High PSRR, with Fast Transient Resoponse

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PCB Footprints
NCP565MN33T2G - onsemi PCB footprint - Other - Other - DFN6 3x3.3 MM, 0.95 PITCH CASE 506AX−01 ISSUE O
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3D Models
NCP565MN33T2G - onsemi  - 3D model - Other - DFN6 3x3.3 MM, 0.95 PITCH CASE 506AX−01 ISSUE O
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NCP565MN33T2G Details

  • Manufacturer Part Number:

    NCP565MN33T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DFN6, 3x3.3x0.9mm, 0.95mm Pitch

  • Pin Count:

    6

  • Manufacturer Package Code:

    506AX

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    1.3 V

  • Input Voltage Absolute-Max:

    18 V

  • Input Voltage-Max:

    9 V

  • Input Voltage-Min:

    4.6 V

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    3.3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1.5 A

  • Output Voltage1-Max:

    3.399 V

  • Output Voltage1-Min:

    3.201 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.13,38

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.9 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3%

  • Width:

    3 mm

NCP565MN33T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure the stability of the output voltage in a noisy environment, it's recommended to use a low-ESR output capacitor, and to add a 10nF-100nF ceramic capacitor in parallel with the output capacitor to filter out high-frequency noise.
  • Although the datasheet specifies a maximum input voltage of 33V, it's recommended to limit the input voltage to 30V to ensure reliable operation and to prevent damage to the device.
  • The power dissipation of the device can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • A 10uF-22uF ceramic or electrolytic capacitor with a voltage rating of 50V or higher is recommended for the input capacitor. The capacitor should be placed as close to the device as possible to minimize noise and ripple.

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