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NCP57302DSADJR4G - onsemi

Description: Obsolete - Ultra Low Noise 120mA LDO (with enable)

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NCP57302DSADJR4G - onsemi PCB footprint - Other - Other - D2PAK 5−LEAD CASE 936A−02 ISSUE D
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NCP57302DSADJR4G - onsemi  - 3D model - Other - D2PAK 5−LEAD CASE 936A−02 ISSUE D
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NCP57302DSADJR4G Details

  • Manufacturer Part Number:

    NCP57302DSADJR4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    5 LEAD D2PAK

  • Package Description:

    D2PAK-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    936A-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.52 V

  • Dropout Voltage1-Nom:

    0.315 V

  • JESD-30 Code:

    R-PSSO-G5

  • JESD-609 Code:

    e3

  • Length:

    10.02 mm

  • Line Regulation-Max (%/V):

    0.043

  • Load Regulation-Max(%):

    1%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    3 A

  • Output Voltage1-Max:

    13 V

  • Output Voltage1-Min:

    1.24 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SMSIP5H,.54,67TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    4.826 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.702 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9.1945 mm

NCP57302DSADJR4G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation may be necessary for optimal design.
  • To ensure reliable start-up and shutdown, it's essential to follow the recommended power-up and power-down sequences outlined in the datasheet. Additionally, ensure that the input voltage rises and falls monotonically, and that the input capacitance is sufficient to filter out noise and ripple.
  • To minimize EMI and noise, it's crucial to follow good layout practices such as separating analog and digital grounds, using a solid ground plane, and minimizing loop areas. Additionally, ensure that the device is placed away from noise sources, and that the input and output traces are properly routed and shielded.
  • To optimize the device for low-power operation, ensure that the input voltage is minimized, and that the device is operated at the lowest possible frequency. Additionally, consider using a low-power mode or shutdown feature if available, and optimize the external component selection for low power consumption.
  • To ensure reliability and long-term stability, it's essential to follow proper soldering and assembly techniques, and to ensure that the device is operated within its recommended operating conditions. Additionally, consider using a robust PCB design, and ensuring that the device is protected from environmental stresses such as temperature, humidity, and vibration.

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