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NCP59801CMLADJTCG - onsemi

Description: 1.6V to 5.5V input voltage; Output voltage from 0.6V; Controlled output voltage slew rate; PSRR: 85 dB at 1 kHz; Low dropout 120mV ar 3.3V / 1A; Ultra-Low Noise: 10µVRMS; WDFNW6 2 x 2mm and DFNW8 3 x 3mm

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Symbol
NCP59801CMLADJTCG - onsemi - PCB symbol
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PCB Footprints
NCP59801CMLADJTCG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFNW8 3x3, 0.65P
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3D Models
NCP59801CMLADJTCG - onsemi - 3D model - Small Outline No-lead - DFNW8 3x3, 0.65P
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NCP59801CMLADJTCG Details

  • Manufacturer Part Number:

    NCP59801CMLADJTCG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-8

  • Package Description:

    DFN-8

  • Manufacturer Package Code:

    507AD

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.339 V

  • Dropout Voltage1-Nom:

    0.211 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max (%/V):

    0.02

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1 A

  • Output Voltage1-Min:

    0.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NCP59801CMLADJTCG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for good airflow.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a heat sink or thermal pad, and ensure good airflow around the device. Additionally, consider using thermal interface materials and following proper soldering techniques.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To troubleshoot OVP and UVP issues, start by verifying the input voltage and ensuring it's within the recommended range. Check the device's pinouts and connections for any signs of damage or corrosion. Use an oscilloscope to monitor the input voltage and device behavior. Consult the datasheet and application notes for guidance on troubleshooting and debugging techniques.
  • To mitigate EMI and RFI in designs using the NCP59801CMLADJTCG, consider using shielding, filtering, and grounding techniques. Ensure proper PCB layout and routing, and use EMI-absorbing materials. Follow best practices for component placement, and consult the datasheet and application notes for specific guidance on EMI and RFI mitigation.

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NCP59801CMLADJTCG Overview

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