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NCP603SN250T1G - onsemi

Description: Obsolete - LDO Regulator, 300 mA, High Performance, with Enable and Enhanced ESD Protection

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Symbol
NCP603SN250T1G - onsemi - PCB symbol
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PCB Footprints
NCP603SN250T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP−5 CASE 483−02
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3D Models
NCP603SN250T1G - onsemi - 3D model - SOT23 (5-Pin) - TSOP−5 CASE 483−02
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NCP603SN250T1G Details

  • Manufacturer Part Number:

    NCP603SN250T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.275 V

  • Dropout Voltage1-Nom:

    0.187 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    6.5 V

  • Input Voltage-Min:

    3 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.01%

  • Load Regulation-Max:

    0.045%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    2.575 V

  • Output Voltage1-Min:

    2.425 V

  • Output Voltage1-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.5 mm

NCP603SN250T1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the copper traces wide and short can help reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to derate the device's power dissipation according to the ambient temperature. Additionally, using a heat sink or thermal interface material can help reduce the device's junction temperature.
  • Exceeding the maximum junction temperature can lead to reduced device reliability, increased thermal resistance, and potentially even device failure. Prolonged operation above the maximum junction temperature can cause permanent damage to the device, resulting in reduced performance or complete failure.
  • To calculate the power dissipation of the device, you need to consider the input voltage, output voltage, output current, and switching frequency. You can use the equation: Pd = (Vin - Vout) x Iout x Fsw x Rds(on) to estimate the power dissipation. Consult the datasheet for specific values and guidelines.
  • The NCP603SN250T1G is designed to meet EMI and EMC standards, but proper PCB layout, component selection, and shielding can help minimize electromagnetic interference. Follow best practices for layout, grounding, and decoupling to ensure compliance with EMI and EMC regulations.

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NCP603SN250T1G Overview

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