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NCP603SN500T1G - onsemi

Description: Obsolete - LDO Regulator, Low Ignd, with Enhanced ESD Protection

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PCB Footprints
NCP603SN500T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - M74VHC1GT32DTT1G
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3D Models
NCP603SN500T1G - onsemi  - 3D model - SOT23 (5-Pin) - M74VHC1GT32DTT1G
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NCP603SN500T1G Details

  • Manufacturer Part Number:

    NCP603SN500T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.23 V

  • Dropout Voltage1-Nom:

    0.157 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    6.5 V

  • Input Voltage-Min:

    5.23 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.01%

  • Load Regulation-Max:

    0.045%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    5.15 V

  • Output Voltage1-Min:

    4.85 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.5 mm

NCP603SN500T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the input voltage rises monotonically and does not droop during start-up. Also, ensure that the output voltage is properly discharged during shutdown to prevent damage to the device.
  • The maximum allowed input voltage ripple is 10% of the nominal input voltage. Exceeding this limit may affect the device's performance and reliability.
  • Yes, but the device's performance and reliability may be affected. The device is rated for operation up to 150°C, but derating may be necessary for high-temperature applications.
  • Use external overcurrent protection (OCP) and overvoltage protection (OVP) circuits to prevent damage to the device. The OCP should be set to 1.5-2 times the maximum output current, and the OVP should be set to 1.1-1.2 times the maximum output voltage.

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