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NCP6343BFCCT1G - onsemi

Description: 3 A Processor - Memory Supply with Dynamic Voltage Scaling, I2C Programming. Transient load helper

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NCP6343BFCCT1G Details

  • Manufacturer Part Number:

    NCP6343BFCCT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WLCSP15, 1.34x1.99

  • Package Description:

    WLCSP15, 1.34x1.99-15

  • Pin Count:

    15

  • Manufacturer Package Code:

    567GB

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES IN PFM CONTROL TECHNIQUE; OUTPUT IN ADJUSTABLE MODE IS 0.6V TO 1.4V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.3 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PBGA-B15

  • JESD-609 Code:

    e1

  • Length:

    1.99 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    15

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    1.4 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA15,3X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max (Isup):

    20 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3300 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.34 mm

NCP6343BFCCT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the input voltage rises and falls monotonically, and that the enable pin is properly biased during start-up and shutdown. A soft-start circuit can also be used to reduce inrush current.
  • The maximum allowed input voltage ripple is 10% of the nominal input voltage. Exceeding this limit may affect the device's performance and reliability.
  • Yes, but the device's performance and reliability may be affected above 125°C. Ensure that the device is properly heat-sinked and that the junction temperature is kept below 150°C.
  • Check the PCB layout for noise coupling, ensure that the output capacitor is properly sized and placed, and verify that the feedback loop is properly compensated. Consult the application note for more information.

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