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NCP703SN28T1G - onsemi

Description: Obsolete - LDO Regulator, 300 mA, Low Dropout, Ultra-Low Iq, Ultra-Low Noise

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PCB Footprints
NCP703SN28T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP−5 CASE 483 ISSUE L
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NCP703SN28T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP−5 CASE 483 ISSUE L
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NCP703SN28T1G Details

  • Manufacturer Part Number:

    NCP703SN28T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.3 V

  • Dropout Voltage1-Nom:

    0.18 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    2.856 V

  • Output Voltage1-Min:

    2.744 V

  • Output Voltage1-Nom:

    2.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.5 mm

NCP703SN28T1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and ensuring good thermal conductivity between the device and the PCB. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device reliability, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device is operated within its specified temperature range to prevent damage or premature failure.
  • The selection of input and output capacitors depends on the specific application requirements, such as output voltage, output current, and ripple voltage. In general, low-ESR capacitors with a high ripple current rating are recommended. Consult the datasheet and application notes for specific guidance on capacitor selection.
  • Key considerations for EMI and EMC compliance when using this device include proper PCB layout, component selection, and shielding. Ensure that the device is placed in a shielded area, and that all high-frequency components are kept away from the device. Follow proper layout guidelines for signal and power traces, and consider using EMI filters and shielding components as needed.

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