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NCP716BCSN500T1G - onsemi

Description: Wide Input Voltage Range: Up to 24V; Ultra-Low Quiescent current: 3.2uA Typical; Fixed Output Voltage Options: from 3.0V to 5.0V; Power Supply Rejection Ratio: 55dB @ 100kHz; Package: TSOP-5 / SOT-23-5

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NCP716BCSN500T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 1
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NCP716BCSN500T1G - onsemi  - 3D model - SOT23 (5-Pin) - 1
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NCP716BCSN500T1G Details

  • Manufacturer Part Number:

    NCP716BCSN500T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Package Description:

    TSOP-5

  • Manufacturer Package Code:

    483

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.955 V

  • Dropout Voltage1-Nom:

    0.6 V

  • Input Voltage Absolute-Max:

    24 V

  • Input Voltage-Max:

    24 V

  • Input Voltage-Min:

    6 V

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    3 mm

  • Line Regulation-Max:

    0.02%

  • Load Regulation-Max:

    0.05996%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    5.1 V

  • Output Voltage1-Min:

    4.9 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP5,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Silver/Gold/Palladium (Ni/Ag/Au/Pd)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.5 mm

NCP716BCSN500T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent overheating.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.
  • Follow the recommended soldering profile and rework conditions specified in the datasheet or onsemi's application notes. Use a soldering iron with a temperature range of 250°C to 260°C, and avoid exposing the device to excessive heat or moisture.

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NCP716BCSN500T1G Overview

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