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NCP731ADNADJR2G - onsemi

Description: Operating Input Voltage Range: 2.7 V to 38 V; Output Voltage Adjustable Range: 1.2 V to 35 V; Very Low Noise: 8 µVRMS (10 Hz to 100 kHz); Low Quiescent Current: 48 µA typ.; Low Dropout: 230 mV typ. at 150 mA; Output Voltage Accuracy ±0.6%; Power Good Output with Programmable Delay (Version B); Stable with Small 1 µF Ceramic Capacitors; Soft Start Input pin

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NCP731ADNADJR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MSOP8 EP 3x3 CASE 846AT ISSUE O
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NCP731ADNADJR2G - onsemi  - 3D model - Small Outline Packages - MSOP8 EP 3x3 CASE 846AT ISSUE O
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NCP731ADNADJR2G Details

  • Manufacturer Part Number:

    NCP731ADNADJR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP8 EP 3x3

  • Package Description:

    MSOP-8

  • Manufacturer Package Code:

    846AT

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.6

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.48 V

  • Dropout Voltage1-Nom:

    0.23 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    35 V

  • Output Voltage1-Min:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NCP731ADNADJR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and ensuring good airflow around the device. A minimum of 2oz copper thickness is recommended for the thermal pad.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Operating the device at the maximum rated current can lead to increased power dissipation, which may result in reduced reliability and lifespan. It is recommended to operate the device at a current level that allows for a safe margin below the maximum rated current to ensure reliable operation.
  • To troubleshoot issues with the device's overcurrent protection feature, check the input voltage, output current, and sense resistor values to ensure they are within the specified ranges. Also, verify that the device is properly configured and that the sense pins are properly connected.
  • The NCP731ADNADJR2G has built-in ESD protection, but it is still important to follow proper ESD handling and storage procedures to prevent damage to the device. Additionally, consider adding external ESD protection devices to the PCB design to provide additional protection.

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