Please enter a minimum 3 letters or numbers
Technical Content
Part Image

NCP752BSN28T1G - onsemi

Description: --

Download NCP752BSN28T1G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
NCP752BSN28T1G - onsemi - PCB symbol
click to zoom
PCB Footprints
NCP752BSN28T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 CASE 483-02
click to zoom
3D Models
NCP752BSN28T1G - onsemi - 3D model - SOT23 (5-Pin) - TSOP-5 CASE 483-02
click to zoom

NCP752BSN28T1G Details

  • Manufacturer Part Number:

    NCP752BSN28T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.2 V

  • Dropout Voltage1-Nom:

    0.13 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    2.856 V

  • Output Voltage1-Min:

    2.744 V

  • Output Voltage1-Nom:

    2.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.5 mm

NCP752BSN28T1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2 oz copper thickness, and ensuring good thermal conduction to the surrounding copper area. A thermal via array can also be used to improve heat dissipation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider derating the device's power dissipation. Additionally, ensure that the device is operated within its specified junction temperature range (TJ) of -40°C to 150°C.
  • The NCP752BSN28T1G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Ensure that the device is handled in an ESD-controlled environment, and use ESD-protective packaging and materials.
  • Yes, the NCP752BSN28T1G is suitable for high-reliability and automotive applications. It's manufactured using a robust process, and onsemi provides a range of reliability and quality data to support its use in these applications. However, it's essential to consult with onsemi's application engineers and review the device's qualification data to ensure it meets the specific requirements of your application.
  • To troubleshoot issues with the device's thermal shutdown feature, start by verifying that the device is properly soldered and that the thermal pad is connected to a suitable heat sink. Check the device's junction temperature (TJ) using an infrared thermometer or thermocouple, and ensure that it's within the specified range. If the issue persists, consult onsemi's application notes and technical support resources for further guidance.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

NCP752BSN28T1G Overview

Use the download button to access the NCP752BSN28T1G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NCP75, or try a keyword search, such as Linear Regulator ICs

Parts related to NCP752BSN28T1G

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑