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NCS20061SN3T1G - onsemi

Description: Rail−to−Rail Input and Output; Wide Supply Range: 1.8 to 5.5 V; Wide Bandwidth: 3 MHz; High Slew Rate: 1.2 V/?s at VS = 1.8 V; Low Supply Current: 125 µ?A per Channel at VS = 1.8 V; Low Input Bias Current: 1 pA Typical; Wide Temperature Range: −40 to 125°C; Available in a Variety of Packages; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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NCS20061SN3T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP−5_2022
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NCS20061SN3T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP−5_2022
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NCS20061SN3T1G Details

  • Manufacturer Part Number:

    NCS20061SN3T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Package Description:

    SOT-23, 5 PIN

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-04-08

  • Manufacturer:

    onsemi

  • YTEOL:

    6.67

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0015 µA

  • Common-mode Reject Ratio-Min:

    53 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.2 V/us

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.5 mm

NCS20061SN3T1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the IC, and using a thermal pad on the bottom of the package. Refer to the onsemi application note AND8393/D for more details.
  • To ensure EMC, follow proper PCB layout and design guidelines, use a shielded enclosure, and add EMI filters or chokes as needed. Also, ensure that the device is properly decoupled and bypassed. Refer to the onsemi application note AND8394/D for more information.
  • The maximum operating temperature range for the NCS20061SN3T1G is -40°C to 150°C. However, the device can be operated up to 175°C for a limited time (less than 1000 hours) with reduced performance and reliability.
  • Yes, the NCS20061SN3T1G is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard and is manufactured using a process that ensures high reliability and low defect rates.
  • To troubleshoot issues with the NCS20061SN3T1G, start by checking the power supply and input voltage, then verify the output voltage and current. Use an oscilloscope to check for oscillations or noise on the output. If the issue persists, consult the onsemi application notes and technical support resources.

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