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NCS21671DM100R2G - onsemi

Description: Wide common mode input range: -0.1 V to 40 V; Supply voltage range: 1.7 V to 5.5 V; Low offset voltage: ±25 µV max; Enable pin; Integrated Filters

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NCS21671DM100R2G - onsemi - PCB symbol
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PCB Footprints
NCS21671DM100R2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - Micro10*
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NCS21671DM100R2G - onsemi - 3D model - Small Outline Packages - Micro10*
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NCS21671DM100R2G Details

  • Manufacturer Part Number:

    NCS21671DM100R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Micro10

  • Package Description:

    MSOP-10

  • Manufacturer Package Code:

    846B

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    35 µA

  • Bias Current-Max (IIB) @25C:

    35 µA

  • Common-mode Reject Ratio-Min:

    109 dB

  • Common-mode Reject Ratio-Nom:

    134 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    60 µV

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.3 V/us

  • Supply Current-Max:

    0.08 mA

  • Supply Voltage Limit-Max:

    6 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Wideband:

    NO

  • Width:

    3 mm

NCS21671DM100R2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the device, and using a thermal pad on the bottom of the package. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, it is recommended to keep the input voltage within the specified operating range of 3.3V ± 10% to ensure reliable operation.
  • The NCS21671DM100R2G is not hermetically sealed, so it is not recommended for use in high-humidity environments. However, if it is necessary to operate the device in a humid environment, consider using a conformal coating or potting the device to protect it from moisture.
  • The recommended soldering profile for the NCS21671DM100R2G involves a peak temperature of 260°C, a dwell time above 217°C of 30 seconds, and a total process time of 60 seconds. It is essential to follow the recommended soldering profile to prevent damage to the device.

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NCS21671DM100R2G Overview

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