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NCS21674DMG050R2G - onsemi

Description: Wide common mode input range: -0.1 V to 40 V; Supply Voltage Range: 2.7. to 5.5V; Low Offset Voltage: 100µV; Low Offset Drift: 1µV/C; Low Gain Error: ±1%; Dual Current Sensing Channel

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NCS21674DMG050R2G Details

  • Manufacturer Part Number:

    NCS21674DMG050R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Micro8

  • Manufacturer Package Code:

    846A-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    84 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Current-Max:

    0.6 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Wideband:

    NO

  • Width:

    3 mm

NCS21674DMG050R2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the device, and using a thermal pad on the bottom of the package. Additionally, keeping the thermal traces as short and wide as possible can help to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Proper thermal design, including heat sinking and airflow, can also help to reduce the device temperature. Additionally, using a thermally conductive material, such as a heat sink or thermal interface material, can improve heat dissipation.
  • Operating the NCS21674DMG050R2G at a lower voltage than the recommended 5V may affect its performance and functionality. The device's output current capability, switching frequency, and overall efficiency may be reduced. Additionally, the device's internal voltage regulators may not function correctly, which can lead to instability or malfunction. It's recommended to operate the device within the specified voltage range for optimal performance.
  • To troubleshoot issues with the device's output voltage regulation, start by verifying the input voltage and ensuring it's within the recommended range. Check the output voltage using a multimeter and compare it to the expected value. If the output voltage is not within the expected range, check the feedback resistors, output capacitors, and voltage sense lines for any signs of damage or incorrect configuration. Also, ensure that the device is properly configured and that the output voltage is not being loaded excessively.
  • The NCS21674DMG050R2G is a high-frequency switching regulator, which can generate electromagnetic interference (EMI). To minimize EMI, it's essential to follow proper PCB layout and design practices, such as using a solid ground plane, placing components close to the device, and using shielding or filtering components. Additionally, ensure that the device is properly decoupled and that the output voltage is filtered to reduce high-frequency noise.

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