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NCS21804DTBR2G - onsemi

Description: Low Input Offset Voltage: 10µV; Low Offset Voltage Drift: 5nV/C; Extended Supply Voltage Range:1.8V to 5.5V. As low as 1.6V ( 0 to 85C),; Quiescent Current: 95uA max; Integrated EMI Filters; Gain Bandwidth Product: 1.5 MHz

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NCS21804DTBR2G - onsemi - PCB symbol
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PCB Footprints
NCS21804DTBR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−14 CASE 948G ISSUE C
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3D Models
NCS21804DTBR2G - onsemi - 3D model - Small Outline Packages - TSSOP−14 CASE 948G ISSUE C
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NCS21804DTBR2G Details

  • Manufacturer Part Number:

    NCS21804DTBR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14 WB

  • Manufacturer Package Code:

    948G

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0006 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    110 dB

  • Common-mode Reject Ratio-Nom:

    134 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    0.7 V/us

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    1500

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    4.4 mm

NCS21804DTBR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Operating the device at a lower voltage than the recommended 3.3V may affect its performance, including reduced output current capability, increased propagation delay, and potentially reduced reliability. It's recommended to operate the device within its specified voltage range for optimal performance and reliability.
  • Yes, the NCS21804DTBR2G is suitable for use in high-reliability and automotive applications. It's manufactured using a robust process, and onsemi provides a range of reliability and quality data to support its use in these applications. However, it's essential to follow the recommended design and qualification guidelines to ensure the device meets the specific requirements of the application.
  • To troubleshoot issues with the device, start by reviewing the datasheet and application notes to ensure that the device is being used within its specified operating conditions. Check the PCB layout and thermal design to ensure that they meet the recommended guidelines. Use a oscilloscope or other test equipment to measure the device's output voltage and current, and compare them to the expected values. If the issue persists, contact onsemi's technical support team for further assistance.

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NCS21804DTBR2G Overview

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