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NCS21871SQ3T2G - onsemi

Description: Low Input Offset Drift over Temperature and Time of 0.4 µV/°C; Automotive AEC-Q100 Qualified; Low Supply Current: 17 µA (typ at 3.3 V); Rail−to−Rail Input and Output; Excellent low frequency (< 1kHz) noise; Low Input Offset Voltage of 45 µV

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PCB Footprints
NCS21871SQ3T2G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - ---SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L
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3D Models
NCS21871SQ3T2G - onsemi  - 3D model - SOT23 (5-Pin) - ---SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L
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NCS21871SQ3T2G Details

  • Manufacturer Part Number:

    NCS21871SQ3T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88A / SC-70-5

  • Package Description:

    SC-70, 5 PIN

  • Manufacturer Package Code:

    419A-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0004 µA

  • Bias Current-Max (IIB) @25C:

    0.0004 µA

  • Common-mode Reject Ratio-Min:

    102 dB

  • Common-mode Reject Ratio-Nom:

    118 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0008 µA

  • Input Offset Voltage-Max:

    45 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.05 V/us

  • Supply Current-Max:

    0.045 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    199526.23149

  • Wideband:

    NO

  • Width:

    1.25 mm

NCS21871SQ3T2G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal protection circuits or thermal sensors to monitor temperature.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Ensure that the PCB layout is designed to minimize ESD susceptibility, and follow proper handling and storage procedures to prevent ESD damage.
  • Use a 4-point Kelvin connection for accurate voltage and current measurements. Ensure that the test equipment is calibrated and configured correctly, and follow the recommended test procedures outlined in the datasheet.

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NCS21871SQ3T2G Overview

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