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NCS325SN2T1G - onsemi

Description: Low Offset Voltage: 14 µV typ, 50 µV max at 25°C; Zero Drift: 0.25 µV/°C max; Low Noise: 1 µVpp, 0.1 Hz to 10 Hz; Quiescent Current: 21 µA typ, 35 µA max at 25°C; Rail−to−Rail Input and Output; Internal EMI Filtering; Supply Voltage: 1.8 V to 5.5 V

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PCB Footprints
NCS325SN2T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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3D Models
NCS325SN2T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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NCS325SN2T1G Details

  • Manufacturer Part Number:

    NCS325SN2T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    5.35

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    50 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.16 V/us

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    501187

  • Wideband:

    NO

  • Width:

    1.5 mm

NCS325SN2T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and use EMI filters or chokes on the input and output lines. Also, ensure that the PCB is designed with EMI mitigation in mind, using techniques such as grounding, shielding, and decoupling.
  • Use a systematic approach to troubleshoot, starting with a review of the device's operating conditions, power supply, and PCB design. Check for signs of overheating, electrical overstress, or other forms of damage. Use oscilloscopes and logic analyzers to monitor the device's signals and identify any anomalies.
  • The POR circuitry ensures that the device resets properly during power-up, but it can also cause issues if not properly understood. Ensure that the power supply is stable and well-regulated, and that the device is not subjected to voltage dips or brownouts during operation.

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NCS325SN2T1G Overview

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