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NCS333ASN2T1G - onsemi

Description: Low Offset Voltage: 10 µV max (NCS333), 30µV max (NCV333A); Zero Drift Architecture with offset drift as low as 0.07 µV/°C max; Quiescent Current: 17 µA Typical at 3.3 V Supply; Supply Voltage: 1.8 V to 5.5 V; Rail−to−Rail Input and Output Voltage; NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable

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NCS333ASN2T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP_5
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NCS333ASN2T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP_5
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NCS333ASN2T1G Details

  • Manufacturer Part Number:

    NCS333ASN2T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.33

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CHOPPER-STAB

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    106 dB

  • Common-mode Reject Ratio-Nom:

    123 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.0004 µA

  • Input Offset Voltage-Max:

    10 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.15 V/us

  • Supply Current-Max:

    45 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    199526.231

  • Wideband:

    NO

  • Width:

    1.5 mm

NCS333ASN2T1G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer.
  • The high current handling capability of the NCS333ASN2T1G requires careful PCB design to ensure that the traces and vias can handle the high currents. Use wide traces, multiple vias, and a solid power plane to minimize resistance and inductance.
  • Use a voltage regulator or a transient voltage suppressor (TVS) to protect the device from overvoltage conditions. Also, consider using a current sense resistor and a fuse or a current limiter to protect against overcurrent conditions.
  • The device's high-frequency operation can generate EMI and RFI. Use shielding, filtering, and grounding techniques to minimize EMI and RFI emissions. Also, consider using a common-mode choke or a ferrite bead to reduce emissions.

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NCS333ASN2T1G Overview

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