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NCT375MNR2G - onsemi

Description: Input Voltage Range from 3.0 V to 5.5 V; Temperature Range from −55°C to +125°C; SMBus/I2C Interface; SMBUS time-out of 75ms to 325ms; Overtemperature Indicator; Support for SMBus/ALERT; Shutdown Mode for Low Power Consumption; One-shot Mode; Available in 8−pin Micro8, SOIC8 and DFN8 Packages; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; 12-bit Temperature-to-Digital Converter

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NCT375MNR2G - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN8 2X2 CASE 506AA ISSUEE
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NCT375MNR2G - onsemi  - 3D model - Small Outline No-lead - DFN8 2X2 CASE 506AA ISSUEE
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NCT375MNR2G Details

  • Manufacturer Part Number:

    NCT375MNR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-8

  • Manufacturer Package Code:

    506AA

  • Country Of Origin:

    Malaysia

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Accuracy-Max (Cel):

    3 Cel

  • Body Breadth:

    2 mm

  • Body Height:

    0.9 mm

  • Body Length or Diameter:

    2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    12

  • Operating Current-Max:

    0.8 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Interface Type:

    2-WIRE INTERFACE

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Termination Type:

    SOLDER

NCT375MNR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A minimum of 2oz copper thickness is recommended for the thermal pad. Additionally, it's essential to keep the thermal pad away from other components to prevent thermal coupling.
  • To ensure accurate temperature measurement, it's crucial to follow proper PCB layout and design guidelines. This includes placing the device in a thermally quiet area, away from heat sources and thermal gradients. Additionally, the device should be calibrated during the manufacturing process, and the calibration data should be stored in the device's internal memory.
  • The maximum allowed voltage on the VDD pin is 5.5V. Exceeding this voltage may damage the device or affect its performance. It's essential to ensure that the power supply voltage is within the recommended operating range of 2.7V to 5.5V.
  • The device's POR and BOR features are designed to ensure reliable operation during power-up and power-down sequences. To handle these features, it's essential to ensure that the power supply voltage ramps up and down slowly, and that the device is not subjected to voltage glitches or noise. Additionally, the system designer should ensure that the device is properly reset during power-up and power-down sequences.
  • The recommended clock frequency for the I2C interface is up to 400 kHz. However, the device can operate at higher clock frequencies, up to 1 MHz, but this may require additional external components and careful PCB design to ensure signal integrity.

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NCT375MNR2G Overview

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