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NCV0372BDWR2G - onsemi

Description: Slew Rate of 1.3 V/µs; Common Mode Input Includes Ground; Output Current to 1.0 A; Zero Deadband Crossover Distortion; Excellent Gain and Phase Margins; Single or Split Supply Operation; Internal Thermal Shutdown; Wide Bandwidth of 1.1 MHz

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NCV0372BDWR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-16 WB CASE 751G ISSUE E
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NCV0372BDWR2G - onsemi  - 3D model - Small Outline Packages - SOIC-16 WB CASE 751G ISSUE E
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NCV0372BDWR2G Details

  • Manufacturer Part Number:

    NCV0372BDWR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-16 WB

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    751G-03

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.5 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    20000 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    YES

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    1.4 V/us

  • Supply Current-Max:

    14 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1400

  • Voltage Gain-Min:

    30000

  • Wideband:

    NO

  • Width:

    7.5 mm

NCV0372BDWR2G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended to ensure good heat dissipation.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The NCV0372BDWR2G has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures during assembly and testing. A minimum of 2 kV human body model (HBM) and 200 V machine model (MM) ESD protection is recommended.
  • Yes, the NCV0372BDWR2G is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it is recommended to follow the recommended operating conditions and to perform thorough testing and validation for the specific application.
  • Start by verifying that the device is operated within the recommended voltage and current ratings. Check for any signs of overheating, and ensure that the PCB is properly designed and assembled. Use a oscilloscope to monitor the device's output and input signals, and consult the datasheet and application notes for troubleshooting guidelines.

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NCV0372BDWR2G Overview

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