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NCV1397BDR2G - onsemi

Description: Adjustable minimum switching frequency with 3% accuracy; Brown-out input; 1 A / 0.5 A Peak Current Sink / Source Drive; Timer-based OCP input with auto-recovery; Second latched OCP level; Adjustable deadtime from 100 ns to 2 us; Adjustable soft-start

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NCV1397BDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−16 NB, LESS PIN 13 CASE 751AM−01 ISSUE O
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NCV1397BDR2G - onsemi  - 3D model - Small Outline Packages - SOIC−16 NB, LESS PIN 13 CASE 751AM−01 ISSUE O
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NCV1397BDR2G Details

  • Manufacturer Part Number:

    NCV1397BDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC-16

  • Package Description:

    SOIC-16/15

  • Manufacturer Package Code:

    751AM

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    11.3 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G15

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    15

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    560 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCV1397BDR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and using thermal vias to dissipate heat to the bottom layer. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below the maximum rating.
  • The recommended input capacitor value is 10uF to 22uF, with a low ESR (Equivalent Series Resistance) and a voltage rating of at least 25V. A ceramic or film capacitor is recommended due to their low ESR and high reliability.
  • To troubleshoot issues with the OCP feature, check the input voltage, output current, and sense resistor values to ensure they are within the recommended specifications. Also, verify that the sense resistor is properly connected and that there are no shorts or opens in the circuit.
  • The recommended output capacitor value is 10uF to 47uF, with a low ESR and a voltage rating of at least 10V above the output voltage. A ceramic or film capacitor is recommended due to their low ESR and high reliability.

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NCV1397BDR2G Overview

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