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NCV20231XV53T2G - onsemi

Description: Low Input Offset Voltage 0.95mV typ; GBWP of 3 MHz; Supply Voltage: 2.7V to 36V

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NCV20231XV53T2G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - 5-Pin SOT-553
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NCV20231XV53T2G - onsemi  - 3D model - SO Transistor Flat Lead - 5-Pin SOT-553
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NCV20231XV53T2G Details

  • Manufacturer Part Number:

    NCV20231XV53T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-553

  • Package Description:

    SOT-535, 5 PIN

  • Manufacturer Package Code:

    463B-01

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.003 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    105 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1200 µV

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSOF

  • Package Equivalence Code:

    FL5/6,.047,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.6 mm

  • Slew Rate-Nom:

    4 V/us

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage Limit-Max:

    40 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    1.2 mm

NCV20231XV53T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system to keep the junction temperature within the recommended range.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection during handling and assembly, follow proper ESD handling procedures, use ESD-safe materials and tools, and ensure that the device is properly grounded during assembly. Additionally, consider using ESD protection devices or circuits to protect the NCV20231XV53T2G from electrostatic discharge.
  • The recommended soldering conditions for the NCV20231XV53T2G involve using a soldering temperature of 260°C (max) for a maximum of 10 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.

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