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NCV21801SQ3T2G - onsemi

Description: Low Input Offset Voltage: 10µV; Low Offset Voltage Drift: 5nV/C; Extended Supply Voltage Range:1.8V to 5.5V. As low as 1.6V ( 0 to 85C),; Quiescent Current: 95uA max; Integrated EMI Filters; Gain Bandwidth Product: 1.5 MHz

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PCB Footprints
NCV21801SQ3T2G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC-88A  (SC70 5 LEAD) CASE 419AC-01
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3D Models
NCV21801SQ3T2G - onsemi  - 3D model - SOT23 (5-Pin) - SC-88A  (SC70 5 LEAD) CASE 419AC-01
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NCV21801SQ3T2G Details

  • Manufacturer Part Number:

    NCV21801SQ3T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88A / SC-70-5

  • Manufacturer Package Code:

    419A-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    110 dB

  • Common-mode Reject Ratio-Nom:

    134 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.7 V/us

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1500

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    1.25 mm

NCV21801SQ3T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the ambient temperature.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • Yes, the NCV21801SQ3T2G is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is manufactured using a robust process that ensures high reliability and low defect rates.
  • To troubleshoot issues related to the OCP feature, check the device's datasheet for the OCP threshold and response time. Verify that the input voltage and current are within the recommended operating range, and ensure that the device is properly soldered and connected to the PCB.

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