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NCV2200AMUTBG - onsemi

Description: Operating Voltage of 0.85 V to 6.0 V; Rail-to-rail Input/Output Performance; Low Supply Current of 10 µA; No Phase Inversion/Glitchless transitioning in or out of Tri-State Mode; Complementary or Open Drain Output Configuration; Available with the Enable Function

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PCB Footprints
NCV2200AMUTBG - onsemi PCB footprint - Other - Other - NCV2200AMUTBG-4
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3D Models
NCV2200AMUTBG - onsemi  - 3D model - Other - NCV2200AMUTBG-4
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NCV2200AMUTBG Details

  • Manufacturer Part Number:

    NCV2200AMUTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN-6

  • Manufacturer Package Code:

    517AA

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.85

  • Amplifier Type:

    COMPARATOR

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.04,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    1100 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.55 mm

  • Supply Current-Max:

    0.017 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

NCV2200AMUTBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. Keep the thermal path short and use a thermal pad on the PCB to connect to the device's thermal pad.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The NCV2200AMUTBG has built-in ESD protection, but additional external protection may be necessary depending on the application. Follow proper PCB design and layout guidelines to prevent latch-up, and consider adding external ESD protection devices if necessary.
  • Consult the application notes and reference designs provided by onsemi for guidance on optimizing the device's performance for specific applications, such as DC-DC converters, motor control, or power supplies.
  • The NCV2200AMUTBG is manufactured according to onsemi's quality and reliability standards, which include compliance with industry standards such as AEC-Q100 and ISO/TS 16949. Consult the device's datasheet and onsemi's quality documentation for more information.

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