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NCV2250SQ2T2G - onsemi

Description: Propagation delay: 50 ns with 100 mV overdrive; Rail-to-rail input: VSS -200 mV to VDD +200 mV; Supply voltage: 1.8 V to 5.5 V; Supply current: 150 μA typical at 5 V supply; Push-pull output; AEC−Q100 qualified and PPAP capable options available; Packages: SC-70 and SOT23-5

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PCB Footprints
NCV2250SQ2T2G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - -SC−88A (SC−70−5/SOT−353)
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NCV2250SQ2T2G - onsemi  - 3D model - SOT23 (5-Pin) - -SC−88A (SC−70−5/SOT−353)
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NCV2250SQ2T2G Details

  • Manufacturer Part Number:

    NCV2250SQ2T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88A / SC-70-5

  • Manufacturer Package Code:

    419A-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-05-11

  • Manufacturer:

    onsemi

  • YTEOL:

    5.8

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.001 µA

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    90 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.25 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NCV2250SQ2T2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for reliable operation.
  • Yes, but ensure the device is properly cooled and the current is within the recommended operating range. Also, consider using a heat sink or thermal pad to dissipate heat.
  • Check the input voltage, ensure the enable pin is properly biased, and verify the output voltage is within the recommended range. Also, check for any short circuits or faulty components.

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NCV2250SQ2T2G Overview

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