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NCV2252SN2T1G - onsemi

Description: Propagation delay: 50 ns with 100 mV overdrive; Rail-to-rail input: VSS -200 mV to VDD +200 mV; Supply voltage: 1.8 V to 5.5 V; Supply current: 150 μA typical at 5 V supply; Open drain output; Packages: SC-70 and SOT23-5; AEC−Q100 qualified and PPAP capable options available

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PCB Footprints
NCV2252SN2T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP−5-2
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3D Models
NCV2252SN2T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP−5-2
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NCV2252SN2T1G Details

  • Manufacturer Part Number:

    NCV2252SN2T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2018-05-11

  • Manufacturer:

    onsemi

  • YTEOL:

    5.8

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.001 µA

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    90 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.25 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NCV2252SN2T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities at higher temperatures.
  • The NCV2252SN2T1G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly to prevent damage. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • To troubleshoot issues with the overcurrent protection feature, check the input voltage, output current, and sense resistor values. Ensure that the sense resistor is correctly sized and that the device is properly configured. Also, verify that the device is not overheating, which can trigger the overcurrent protection.
  • When paralleling multiple devices, ensure that each device has its own sense resistor and that the output currents are properly balanced. Also, consider the thermal implications of paralleling devices and ensure that the PCB design can handle the increased power dissipation.

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