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NCV330MUTBG - onsemi

Description: 1.8 V to 5.5 V operating voltage; 30 mΩ RDS(ON); DC current up to 3 A; Buit in soft start; Reverse voltage protection; Active high enable pin with integrated bridge

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Symbol
NCV330MUTBG - onsemi - PCB symbol
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PCB Footprints
NCV330MUTBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - UDFN4 CASE 517CE
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3D Models
NCV330MUTBG - onsemi - 3D model - Small Outline No-lead - UDFN4 CASE 517CE
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NCV330MUTBG Details

  • Manufacturer Part Number:

    NCV330MUTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN-4

  • Package Description:

    UDFN-4

  • Manufacturer Package Code:

    517CE

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.08

  • Analog IC - Other Type:

    SPST

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-PDSO-N4

  • JESD-609 Code:

    e1

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • On-state Resistance-Max (Ron):

    50 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.2 mm

NCV330MUTBG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities at higher temperatures.
  • The NCV330MUTBG has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly to prevent damage. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • Yes, the NCV330MUTBG is suitable for high-reliability and automotive applications. It's AEC-Q100 qualified and meets the requirements for automotive applications. However, it's essential to follow the recommended operating conditions and ensure proper design and testing to meet the specific application's requirements.
  • To troubleshoot issues with the NCV330MUTBG, start by reviewing the device's operating conditions, checking for proper power supply and input voltage, and verifying that the device is properly soldered and connected. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue.

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NCV330MUTBG Overview

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