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NCV331SN3T1G - onsemi

Description: Guaranteed 2.7 V and 5.0 V Performance; Input common-mode voltage range extends to ground; Open drain output for Wired-OR applications; Low Quiescent Current: 60 A/channel TYP @ 5.0 V; Low Saturation Voltage 200 mV TYP @ 5.0 V; Propagation Delay 200 ns TYP @ 5.0 V

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Symbol
NCV331SN3T1G - onsemi - PCB symbol
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PCB Footprints
NCV331SN3T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP−5 CASE 483 ISSUE N
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3D Models
NCV331SN3T1G - onsemi - 3D model - SOT23 (5-Pin) - TSOP−5 CASE 483 ISSUE N
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NCV331SN3T1G Details

  • Manufacturer Part Number:

    NCV331SN3T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5

  • Package Description:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.65

  • Amplifier Type:

    COMPARATOR

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    800 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NCV331SN3T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities at higher temperatures.
  • The NCV331SN3T1G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly to prevent damage. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • Yes, the NCV331SN3T1G is qualified for automotive and high-reliability applications. However, it's essential to review the device's AEC-Q100 qualification and to consult with onsemi's application engineers to ensure the device meets the specific requirements of your application.
  • To troubleshoot issues with the overcurrent protection feature, check the device's datasheet for the expected behavior, verify the PCB layout and component selection, and use a current probe or oscilloscope to measure the current and voltage waveforms.

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NCV331SN3T1G Overview

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