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NCV33274ADTBR2G - onsemi

Description: Power Bandwidth: 160 kHz; Unity Gain Stable: w/Capacitance Loads to 500 pF; ESD Diodes Provide Added Protection to the Inputs; Input Offset Voltage Trimmed to 100 µV (Typ); Low Noise: 18 nV/ (sq. root Hz) @ 1.0 kHz; Low Input Bias Current: 300 nA; Single or Split Supply Operation: +3.0 V to +36 V or +/-1.5 V to +/-18 V; Excellent Frequency Stability; Large Output Voltage Swing: +14.1 V/ -14.6 V; Low Total Harmonic Distortion: 0.003%; Low Input Offset Current: 3.0 nA; High Slew Rate: 10 V/µs; High Input Resi

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NCV33274ADTBR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−14 CASE 948G ISSUE C
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NCV33274ADTBR2G - onsemi  - 3D model - Small Outline Packages - TSSOP−14 CASE 948G ISSUE C
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NCV33274ADTBR2G Details

  • Manufacturer Part Number:

    NCV33274ADTBR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    948G

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    4.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.8 µA

  • Bias Current-Max (IIB) @25C:

    0.65 µA

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Offset:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    8 V/us

  • Slew Rate-Nom:

    10 V/us

  • Supply Current-Max:

    12 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5500

  • Voltage Gain-Min:

    19950

  • Width:

    4.4 mm

NCV33274ADTBR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range, use a heat sink or thermal pad, and consider using a thermal interface material to improve heat transfer.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It is essential to ensure that the device operates within its specified temperature range.
  • To protect the device from electrical overstress (EOS), use a transient voltage suppressor (TVS) or a zener diode to clamp voltage transients, and ensure that the device is operated within its specified voltage range.
  • The recommended soldering conditions for this device involve using a soldering iron with a temperature of 260°C (500°F) for 10 seconds or less, and ensuring that the device is not exposed to temperatures above 260°C (500°F) for an extended period.

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NCV33274ADTBR2G Overview

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