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NCV4276BDT33RKG - onsemi

Description: Linear Voltage Regulator IC Positive Fixed 1 Output 400mA DPAK-5 , 3.3V ~ 45V , -40°C ~ 150°C

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PCB Footprints
NCV4276BDT33RKG - onsemi PCB footprint - Other - Other - DPAK−5, CENTER LEAD CROP CASE 175AA ISSUE B_2026
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NCV4276BDT33RKG Details

  • Manufacturer Part Number:

    NCV4276BDT33RKG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DPAK 5 Center Lead Crop

  • Package Description:

    DPAK-5/4

  • Pin Count:

    5

  • Manufacturer Package Code:

    175AA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.25 V

  • Input Voltage Absolute-Max:

    45 V

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    4.5 V

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Length:

    6.54 mm

  • Line Regulation-Max:

    0.015%

  • Load Regulation-Max:

    0.02%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1.1 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SMSIP5H,.37,50TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.38 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.14 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    6.095 mm

NCV4276BDT33RKG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to consider the device's thermal derating. Additionally, ensure that the device is operated within its specified temperature range.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's crucial to ensure that the device operates within its specified temperature range to maintain reliability.
  • To handle ESD protection, follow proper handling and storage procedures, and consider using ESD-protective packaging and materials. Additionally, design the PCB with ESD protection in mind, using components such as TVS diodes or ESD-protection ICs.
  • Operating the device at the maximum current rating can lead to increased power dissipation, which may affect the device's reliability and lifespan. Ensure that the device is operated within its specified current rating and that proper thermal design and layout guidelines are followed.

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