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NCV47711PDAJR2G - onsemi

Description: Adjustable Voltage Version (from 5 V to 20 V) 3% Output Voltage; Enable Input; Adjustable Current Limit (from 10 mA to 350 mA)with 10% accuracy; AEC-Q100 Qualified; Protection: Current Limitation, Thermal Shutdown, Reverse Input Voltage

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NCV47711PDAJR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−8 EP
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NCV47711PDAJR2G - onsemi  - 3D model - Small Outline Packages - SOIC−8 EP
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NCV47711PDAJR2G Details

  • Manufacturer Part Number:

    NCV47711PDAJR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 EP

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751AC

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.7

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.25 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Line Regulation-Max (%/V):

    0.0526

  • Load Regulation-Max(%):

    1.4%

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.35 A

  • Output Voltage1-Max:

    20 V

  • Output Voltage1-Min:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCV47711PDAJR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to consider the device's thermal derating. Additionally, ensure that the device is operated within its specified temperature range.
  • The NCV47711PDAJR2G has built-in ESD protection, but it's still important to follow proper ESD handling and storage procedures to prevent damage. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • To troubleshoot issues with the overcurrent protection feature, check the device's datasheet for the specific overcurrent protection threshold and response time. Verify that the device is properly configured and that the current sense resistor is correctly sized. Also, check for any external circuitry that may be interfering with the overcurrent protection feature.
  • When using the NCV47711PDAJR2G in a high-reliability or safety-critical application, consider the device's fault tolerance, redundancy, and fail-safe operation. Ensure that the device is properly derated, and that the system is designed to accommodate potential device failures.

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