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NCV51513AAMNTWG - onsemi

Description: 2.0 A Source, 3 A Sink Output Current Capability; Bootstrap Supply Voltage up to 150V; Typical Rise/Fall times 9 ns/7 ns with 1 nF load; Propagation delay 50 ns A version, 20 ns B version; Max 9 ns Delay Matching between Channels; Input cross-conduction prevention; Dead Time Options - No Dead Time (xA version) - Internal 80 ns fixed Dead Time (xB version); Enable pin; AEC Qualified

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PCB Footprints
NCV51513AAMNTWG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFNW10, 3x3, 0.5P CASE 507AG ISSUE B
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3D Models
NCV51513AAMNTWG - onsemi  - 3D model - Small Outline No-lead - DFNW10, 3x3, 0.5P CASE 507AG ISSUE B
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NCV51513AAMNTWG Details

  • Manufacturer Part Number:

    NCV51513AAMNTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-10

  • Package Description:

    DFN-10

  • Manufacturer Package Code:

    507AG

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max:

    2.3 mA

  • Supply Voltage-Max:

    19 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    19 V

  • Supply Voltage1-Min:

    8 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.07 µs

  • Turn-on Time:

    0.07 µs

  • Width:

    3 mm

NCV51513AAMNTWG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To troubleshoot issues related to output voltage regulation, check the input voltage, output load, and feedback network. Ensure that the feedback resistors are correctly selected, and the output capacitor is suitable for the application. Also, verify that the device is not operating in a dropout condition.
  • To minimize EMI/EMC issues, use a suitable layout, keep the switching node (SW) as short as possible, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure that the device is properly decoupled, and the output capacitor is selected to minimize ringing.

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