Description:High Current Output (+4.0/-6.0 A) at IGBT Miller Plateau voltages; Low VOH and VOL; DESAT Protection with Programmable Delay; Bipolar power supply support
The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the ambient temperature.
The NCV5707BDR2G has built-in ESD protection diodes on all pins, and latch-up prevention is achieved through the use of guard rings and substrate ties. However, it's still important to follow proper ESD handling procedures and PCB design guidelines to prevent damage.
Yes, the NCV5707BDR2G is AEC-Q100 qualified, making it suitable for automotive applications. However, it's essential to ensure that the device is used within its specified operating conditions and that the system design meets the required automotive standards and regulations.
The recommended soldering profile for the NCV5707BDR2G is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. It's essential to follow the recommended soldering profile to prevent damage to the device.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NCV5707BDR2G Overview
Use the download button to access the NCV5707BDR2G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NCV57,
or try a keyword search, such as MOSFET Drivers
