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NCV57100DWR2G - onsemi

Description: High Current Output(±7 A) at Miller Plateau Voltages; Short Propagation Delays with Accurate Matching; DESAT with Soft Turn Off; Active Miller Clamp and Negative Gate Voltage; High Transient & Electromagnetic Immunity; 5 kV Galvanic Isolation

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NCV57100DWR2G - onsemi - PCB symbol
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NCV57100DWR2G - onsemi PCB footprint - Other - Other - NCV57100DWR2G
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NCV57100DWR2G - onsemi - 3D model - Other - NCV57100DWR2G
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NCV57100DWR2G Details

  • Manufacturer Part Number:

    NCV57100DWR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-16W

  • Package Description:

    SOIC-16

  • Manufacturer Package Code:

    751G-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    7.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    32 V

  • Supply Voltage1-Min:

    11.7 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.09 µs

  • Turn-on Time:

    0.09 µs

  • Width:

    7.5 mm

NCV57100DWR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device.
  • The NCV57100DWR2G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. This includes using an ESD wrist strap, ESD mat, and storing the device in an ESD-protected package.
  • Yes, the NCV57100DWR2G is AEC-Q100 qualified, which means it meets the stringent requirements for automotive applications. However, it's essential to ensure that the device is used within its recommended operating conditions and that the system design meets the required automotive standards.
  • The recommended soldering profile for the NCV57100DWR2G is a reflow soldering process with a peak temperature of 260°C for 20-30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.

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NCV57100DWR2G Overview

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