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NCV6323FELMTW18TBG - onsemi

Description: 2.8 V to 5.5 V Input voltage; Fixed Output Voltage; Up to 1.6 A DC output current; 3 MHz Switching Frequency; Synchronous Rectification; Soft Start / Over Current; WDFNW8, 2x2 mm, 0.5 mm pitch package; AEC-Q100 Qualified and PPAP Capable

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PCB Footprints
NCV6323FELMTW18TBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - WDFNW8 2x2_2024
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NCV6323FELMTW18TBG - onsemi  - 3D model - Small Outline No-lead - WDFNW8 2x2_2024
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NCV6323FELMTW18TBG Details

  • Manufacturer Part Number:

    NCV6323FELMTW18TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFNW-8

  • Package Description:

    WDFN-8

  • Manufacturer Package Code:

    511CL

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    45 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.8 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.6 A

  • Output Voltage-Max:

    1.827 V

  • Output Voltage-Min:

    1.773 V

  • Output Voltage-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3300 kHz

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NCV6323FELMTW18TBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to keep the thermal path short and use a thermal pad on the PCB.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, and consider using a thermal monitoring and protection circuit.
  • The NCV6323FELMTW18TBG has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NCV6323FELMTW18TBG is AEC-Q100 qualified and suitable for use in high-reliability and automotive applications. However, ensure that the device is used within the recommended operating conditions and that the application meets the required safety and reliability standards.
  • Use a systematic approach to troubleshoot issues, starting with a review of the PCB layout, component selection, and soldering quality. Check for signs of overheating, electrical overstress, or ESD damage. Use oscilloscopes or logic analyzers to monitor the device's behavior and identify potential issues.

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NCV6323FELMTW18TBG Overview

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