SC-82AB 4 LEAD 2.0x1.25x0.95 mm, max with leads is 2.2x2.4x1.1mm
Pin Count:
4
Manufacturer Package Code:
419C-02
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
2 Days
Manufacturer:
onsemi
YTEOL:
0
Adjustability:
FIXED
Dropout Voltage1-Max:
0.42 V
Dropout Voltage1-Nom:
0.23 V
Input Voltage Absolute-Max:
6 V
Input Voltage-Max:
6 V
Input Voltage-Min:
4.3 V
JESD-30 Code:
R-PDSO-G4
JESD-609 Code:
e3
Length:
2 mm
Line Regulation-Max:
0.02%
Load Regulation-Max:
0.04%
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Outputs:
1
Number of Terminals:
4
Operating Temperature TJ-Max:
150 °C
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Output Current1-Max:
0.1 A
Output Voltage1-Max:
3.432 V
Output Voltage1-Min:
3.168 V
Output Voltage1-Nom:
3.3 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
TSOP
Package Equivalence Code:
SOT-343R
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, THIN PROFILE
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Regulator Type:
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
Screening Level:
AEC-Q100
Seated Height-Max:
1.1 mm
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Pitch:
1.3 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Voltage Tolerance-Max:
2%
Width:
1.25 mm
NCV662SQ33T1G Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the ambient temperature.
Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within the specified voltage, current, and temperature ranges.
To troubleshoot issues related to the OTP feature, check the device's thermal design, ensure that the thermal interface material is properly applied, and verify that the device is not operating beyond its recommended power dissipation. Also, check for any signs of thermal runaway or overheating.
The recommended soldering and rework conditions for this device involve using a soldering iron with a temperature of 260°C (500°F) for 10 seconds or less, and a peak reflow temperature of 240°C (464°F) for 20 seconds or less.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NCV662SQ33T1G Overview
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