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NCV7041DM3G050R2G - onsemi

Description: Input Offset Voltage: 300 µV; Bandwidth: 100 kHz; Gain Error: ±0.3%; Common-Mode Input Range: -6 to 80 V; Multiple Gain Options: 14, 20, 50, 100 V/V; CMRR: 90 dB

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NCV7041DM3G050R2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - Micro8
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NCV7041DM3G050R2G Details

  • Manufacturer Part Number:

    NCV7041DM3G050R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Micro8

  • Package Description:

    MSOP-8

  • Manufacturer Package Code:

    846A-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2020-09-22

  • Manufacturer:

    onsemi

  • YTEOL:

    5.35

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    500 µA

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    105 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    400 µV

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    2.8 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    100

  • Wideband:

    NO

  • Width:

    3 mm

NCV7041DM3G050R2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power handling capabilities according to the temperature rating.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the specified temperature range to maintain reliability and performance.
  • The NCV7041DM3G050R2G is an AEC-Q100 qualified device, making it suitable for automotive applications. However, for high-reliability applications, it's essential to consult with onsemi's application engineers to ensure the device meets the specific requirements and to discuss any necessary qualifications or testing.
  • The NCV7041DM3G050R2G has built-in ESD protection and latch-up prevention mechanisms. However, it's still essential to follow proper handling and assembly procedures to prevent damage during manufacturing and operation.

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