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NCV7329MW0R2G - onsemi

Description: LIN−Bus Transceiver ♦ Compliant to ISO 17987−4 (Backwards Compatible to LIN Specification rev. 2.x, 1.3) and SAE J2602 ♦ Bus Voltage ?42 V ♦ Transmission Rate 1 kbps to 20 kbps ♦ TxD Timeout Function ♦ Integrated Slope Control; Protection ♦ Thermal Shutdown ♦ Undervoltage Protection ♦ Bus Pins Protected Against Transients in an Automotive Environment; Modes ♦ Normal Mode: LIN Transceiver Enabled, Communication via the Bus is Possible ♦ Sleep Mode: LIN Transceiver Disabled, the Consumption from VBB is Minimi

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NCV7329MW0R2G - onsemi - PCB symbol
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PCB Footprints
NCV7329MW0R2G - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFNW8 3x3, 0.65P CASE 507AB
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3D Models
NCV7329MW0R2G - onsemi - 3D model - Small Outline No-lead - DFNW8 3x3, 0.65P CASE 507AB
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NCV7329MW0R2G Details

  • Manufacturer Part Number:

    NCV7329MW0R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-8

  • Package Description:

    DFN-8

  • Manufacturer Package Code:

    507AB

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.8

  • Data Rate:

    20 Mbps

  • JESD-30 Code:

    S-PDSO-N8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max:

    6.5 mA

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    LIN TRANSCEIVER

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NCV7329MW0R2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. Ensure that the thermal pad is connected to a large copper area to reduce thermal resistance.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • Use a pi-filter or a common-mode choke to reduce electromagnetic interference (EMI). Add capacitors between the input and output pins to ground to filter out high-frequency noise. Ensure that the PCB layout is designed to minimize loop areas and reduce radiation.
  • Implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage from voltage surges and excessive current. Use a voltage regulator or a TVS diode to clamp the input voltage, and add a current-sensing resistor to detect overcurrent conditions.
  • Use a 4-wire Kelvin connection to measure the device's voltage and current accurately. Ensure that the test equipment is calibrated and configured correctly to prevent measurement errors. Use a thermal camera or an infrared thermometer to measure the device's temperature.

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NCV7329MW0R2G Overview

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