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NCV7349D10R2G - onsemi

Description: Low Electromagnetic Emission (EME) and Extremely High Electromagnetic Immunity; Compatible with the ISO 11898−5 Standard; High Speed (up to 1 Mbps); No Disturbance of the Bus Lines with an Un−powered Node; Transmit Data (TxD) Dominant Time−out Function; Very Low Current Standby Mode with Wake−up via the Bus; Very Low EME without Common−mode (CM) Choke; Under All Supply Conditions the Chip Behaves Predictably; Very High ESD Robustness of Bus Pins, >10 kV System ESD Pulses; Thermal Protection; Bus Pins Short

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NCV7349D10R2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 CASE 751AZ ISSUE B
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NCV7349D10R2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 CASE 751AZ ISSUE B
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NCV7349D10R2G Details

  • Manufacturer Part Number:

    NCV7349D10R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751AZ

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.92

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9276 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7272 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.937 mm

NCV7349D10R2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. Ensure that the thermal pad is connected to a large copper area on the PCB.
  • Use a heat sink or thermal interface material to reduce the thermal resistance between the device and the ambient environment. Also, ensure that the device is operated within the recommended temperature range and that the junction temperature is kept below 150°C.
  • The NCV7349D10R2G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NCV7349D10R2G is AEC-Q100 qualified and suitable for use in high-reliability and automotive applications. However, ensure that the device is operated within the recommended temperature range and that the application meets the required reliability and quality standards.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply voltage, input signals, and output loads to ensure they are within the recommended specifications. Consult the datasheet and application notes for troubleshooting guidelines.

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NCV7349D10R2G Overview

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