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NCV7441D20G - onsemi

Description: ON Semiconductor NCV7441D20G, CAN Transceiver 1Mbit/s 2-channel ISO 11898, ISO 11898-2, ISO 11898-5, SAE J2284, 14-Pin

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NCV7441D20G Details

  • Manufacturer Part Number:

    NCV7441D20G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    751AP

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCV7441D20G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to have a solid copper plane under the device, and to use thermal vias to connect the plane to the thermal pad of the device. Additionally, keeping the PCB layer stack-up symmetrical and using a thermal interface material (TIM) between the device and the heat sink can also improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the guidelines for thermal design and layout, and to ensure that the device is operated within its specified temperature range. Additionally, using a heat sink and thermal interface material can help to reduce the junction temperature of the device.
  • When using the NCV7441D20G, it is recommended to follow good EMI and RFI design practices, such as using a shielded enclosure, keeping the device and its associated components away from antennas and other EMI-sensitive components, and using EMI filters and shielding on the input and output lines.
  • To troubleshoot issues with the NCV7441D20G, it is recommended to follow a systematic approach, starting with a review of the device's operating conditions and environment. Check for proper power supply, correct input and output connections, and ensure that the device is operated within its specified temperature range. Use oscilloscopes and other diagnostic tools to monitor the device's behavior and identify any anomalies.
  • When using the NCV7441D20G, it is recommended to follow a controlled power sequencing and startup procedure to ensure that the device is powered up correctly and safely. This may involve using power sequencing controllers or other devices to control the power-up sequence and ensure that the device is powered up in a controlled and predictable manner.

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NCV7441D20G Overview

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Part Image NCV7441D20R2G onsemi

Interface Circuit, PDSO14