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NCV7691D10R2G - onsemi

Description: Constant Current Output for LED String Drive; External Bipolar Device for Wide Current Range Flexibility - With BCP56 Transistor, Can Drive 8 Strings Concurrently (ref. Datasheet Info); External Programming Current Resistor; Pulse Width Modulation (PWM) Control; Open LED String Diagnostic; Short−Circuit LED string Diagnostic; Multiple LED String Control; Overvoltage Set Back Power Limitation; Negative Temperature Coefficient Current Control Option; AEC Q100 Qualified

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NCV7691D10R2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 CASE 751AZ ISSUE B
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NCV7691D10R2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 CASE 751AZ ISSUE B
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NCV7691D10R2G Details

  • Manufacturer Part Number:

    NCV7691D10R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751AZ

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    14 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    4 mA

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCV7691D10R2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad connected to the ground plane.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range (-40°C to 150°C). Use a heat sink or thermal pad to dissipate heat, and avoid overheating the device. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The recommended soldering conditions for NCV7691D10R2G are: peak temperature 260°C, time above 217°C 30 seconds, and time above 183°C 60 seconds. Use a soldering iron with a temperature range of 350°C to 400°C, and ensure that the soldering process is completed within 3 seconds.
  • During storage and shipping, handle the device by the body, not the leads. Avoid bending or flexing the leads, and store the device in a dry, cool place away from direct sunlight. Use anti-static packaging materials to prevent electrostatic discharge (ESD) damage.
  • To handle moisture-sensitive devices like NCV7691D10R2G, follow these precautions: store the device in a dry, cool place away from direct sunlight; use a dry, nitrogen-filled package or a moisture barrier bag; and bake the device at 125°C for 24 hours before use if it has been exposed to moisture.

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NCV7691D10R2G Overview

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