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NCV78702MW0R2G - onsemi

Description: Integrated Failure Diagnostic; Fail Save Operating (FSO) Mode, Stand−Alone Mode; SPI Interface for Dynamic Control of System Parameters; Low EMC Emission; PCB Trace for Current Sense Shunt Resistor is Possible; High Operating Frequencies to Reduce Inductor Sizes; Programmable Input Current Limitation; Integrated Boost Controller; Active Input Filter with Low Current Ripple from Battery; Minimum of External Components; High Overall Efficiency; Multiphase Booster; Single Chip

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PCB Footprints
NCV78702MW0R2G - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN24 4x4 0.5P CASE 485L-01
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3D Models
NCV78702MW0R2G - onsemi  - 3D model - Quad Flat No-Lead - QFN24 4x4 0.5P CASE 485L-01
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NCV78702MW0R2G Details

  • Manufacturer Part Number:

    NCV78702MW0R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN-24

  • Package Description:

    QFN-24

  • Manufacturer Package Code:

    485L

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    111 Weeks

  • Date Of Intro:

    2016-01-20

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Data Input Mode:

    SERIAL

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    50 mA

  • Supply Voltage-Max:

    3.5 V

  • Supply Voltage-Min:

    3.1 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

NCV78702MW0R2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling capabilities at high temperatures.
  • The NCV78702MW0R2G has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and use ESD-protective packaging. For latch-up prevention, ensure that the device is not exposed to excessive voltage or current, and use a latch-up immune design.
  • Yes, the NCV78702MW0R2G is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended operating conditions, and consult with onsemi's application engineers for specific requirements.
  • Use a thermal imaging camera to identify hotspots, and check for proper PCB layout, thermal management, and power handling. For malfunction, verify the input voltage, current, and operating conditions are within the recommended specifications.

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