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NCV8160AMX330TBG - onsemi

Description: Ultra High PSRR 90dB at 1kHz, 20mA; Ultra Low Output Noise 10µVRMS; Very Low Dropout 90mV@250mA; Ultra Low Quiescent current 18µA

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NCV8160AMX330TBG Details

  • Manufacturer Part Number:

    NCV8160AMX330TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    XDFN-4

  • Package Description:

    XDFN-4

  • Manufacturer Package Code:

    711AJ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.145 V

  • Dropout Voltage1-Nom:

    1 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    S-PDSO-N4

  • Length:

    1 mm

  • Line Regulation-Max:

    0.0792%

  • Load Regulation-Max(%):

    0.041085%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC4,.04,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.43 mm

  • Surface Mount:

    YES

  • Technology:

    PMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1 mm

NCV8160AMX330TBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Critical timing parameters include the switching frequency, rise and fall times, and dead time. Ensure that the device is operated within the recommended frequency range, and that the gate drive circuitry is designed to meet the recommended rise and fall times.
  • Use a voltage regulator or overvoltage protection circuit to prevent voltage spikes or surges. Also, consider using current sense resistors and overcurrent protection circuits to prevent excessive current draw.
  • A non-inverting gate drive circuit with a high-current gate driver IC and a low-impedance gate resistor is recommended. The gate drive circuit should be designed to provide a fast rise time and a low output impedance.

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NCV8160AMX330TBG Overview

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