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NCV8161AMX330TBG - onsemi

Description: 450 mA, Ultra-Low Noise and High PSRR LDO Regulator for RF and Analog Circuits 3.3V, Active Discharge

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NCV8161AMX330TBG - onsemi  - 3D model
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NCV8161AMX330TBG Details

  • Manufacturer Part Number:

    NCV8161AMX330TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    XDFN-4

  • Manufacturer Package Code:

    711AJ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.26 V

  • Dropout Voltage1-Nom:

    1 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    S-PDSO-N4

  • Length:

    1 mm

  • Line Regulation-Max:

    0.000792%

  • Load Regulation-Max(%):

    0.057585%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.45 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC4,.04,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.43 mm

  • Surface Mount:

    YES

  • Technology:

    PMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1 mm

NCV8161AMX330TBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling capabilities at high temperatures.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially catastrophic failure. It's essential to ensure the device operates within the recommended temperature range.
  • Yes, the device is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended design and manufacturing guidelines to ensure the device meets the required standards.
  • Use a systematic approach to troubleshoot, checking for proper power supply, signal integrity, and thermal management. Consult the datasheet and application notes for guidance, and consider seeking support from onsemi's technical support team.

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NCV8161AMX330TBG Overview

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